Thin Film Technology (a subsidiary of Williams Advanced Materials) introduces its Visi-Lid™, An Optical Window Assembly, to the European Market Thin Film Technologies (TFT) a subsidiary of Williams Advanced Materials (WAM) will be d?ting its Visi-lid™ product line to the European market place during the Night Vision exhibition in London, November 1- 2 2006.
Visi-Lids™ provide an integrated approach for hermetically sealing optoelectronic devices. TFT and WAM offer a unique set of capabilities that include: thin film optical coatings, precision machining & soldering technology provides a turn key solution to complicated packaging requirements.
Engineering support for Visi-Lids™ is provided from design through final assembly. A large array of materials options is available, from glass, and quartz, to silicon, germanium, and sapphire windows. Coating capabilities range from Visible, through Long Wave Infra-red. Solderable seal rings can be provided for seam seal or solder seal assembly.
Night Vision, Thermal Imaging Devices and Optical Switches are a few of the technologies currently employing the Visi-Lids™ product line. TFT will also be exhibiting their Thin Film Coating and custom Hybrid Circuit capabilities. Visit booth 34 to learn more.
For specific inforamtion about Visi-Lids™ go to http://www.williams-adv.com/packagingMaterials/visilids.php
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