Williams plays a key role in the development of hybrid micro electronic packaging materials and new products.
Micro Electronic Packaging Materials
For over 30 years, Williams Advanced Materials (WAM) has supplied various materials to the micro electronic industries. We continue to be a reliable source for precious metal ribbons, preforms, bonding wire and Combo Lids®. WAM has become a leader in providing Engineered Solutions for your packaging cover/lid needs, and our library of preform tools is second to none. Our state-of-the-art manufacturing sites around the world allow us to offer industry leading lead-times as well as unsurpassed customer service. All our products are manufactured within our ISO certified quality systems. |
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