Williams plays a key role in the development of hybrid micro electronic packaging materials and new products.
Micro Electronic Packaging Materials
For over 30 years, Williams Advanced Materials (WAM) has supplied packaging materials to the microelectronics industry. We continue to be a reliable source for precious metal ribbons, solder preforms, bonding wire and Combo Lids®. Our product offering also includes: Air Cavity and BeO Packages, CuPacksTM, plated flanges, Ceramic Substrates (Direct Bond Copper and Metallized Ceramic) manufactured by Zentrix Technologies.
Zentrix Technologies, like Williams Advanced Materials, is a subsidiary of Brush Engineered Materials. By joining the technology and sales staffs together, we are better able to service our customers and their new product development needs
We are leaders in providing Engineered Solutions for ceramic packages and hermetic cover/lids, and our tooling libraries for solder preforms and ceramic packages are extensive. Our state-of-the-art manufacturing sites around the world allow us to offer industry leading lead-times as well as unsurpassed customer service. All products are manufactured within our ISO certified quality systems. |
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