Proprietary process delivers cleaner and more uniform wire than traditional methods.
Williams Advanced Materials bonding wire and ribbon is manufactured using a proprietary hydrostatic extrusion process, providing a cleaner and more uniform wire. The extrusion process eliminates imperfections due the extreme pressure that envelops the metal as it passes through the die; therefore, fewer reductions are necessary. The end product produces smaller, more uniform ball size on the bonding pad and reduces bonding tool problems.
Gold Bonding Ribbon is designed for high-power, high-reliability applications such as microwave devices. Williams' extrusion process is well suited to achieve the metallurgical consistency and winding requirements of all bonding ribbon applications.
Procedure for Storing Wire/Ribbon (PDF)
Typical Mechanical Properties for Gold Bonding Wire and Ribbon
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