Ceramic air cavity packages for discrete Si, GaAs and GaN RF power transistors.
Zentrix Technologies provides ceramic air cavity packages that are industry standard outlines for RF Power Transistors. These packages offer proven performance and reliability. The cost-effective packages are excellent platforms for wireless applications in the 500 MHz to 3.5 GHz frequency range. Zentrix packages are used for discrete Si, GaAs and GaN devices. The high thermal conductivity flange promotes low thermal resistance θJC, and alumina ring frames provide very low dielectric loss at RF frequencies. The leads are Alloy 42, and are plated with Ni and Au to provide superlative electrical conduction at RF frequencies.
Although Zentrix provides industrial standard outlines, Zentrix also provides customization to meet demanding applications.
- Brazed construction provides excellent mechanical reliability
- Ni:Co + Au electrolytic plating compatible with AuSi eutectic die attach or AuSn eutectic die attach
- Resistant to silver dendrite formation
- Customization of package design
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