Ceramic packages for discrete RF and microwave devices.
The Zentrix unit of Williams Advanced Materials is a leading manufacturer of ceramic packages for discrete RF and microwave devices. Our packages are used for a wide variety of high power transistors and MMICs, including transistors fabricated in Si, GaAs and GaN. Our packages are available in surface mount designs as well as bolt-down versions. We offer classic BeO packages for Si VMOS transistors, as well as ceramic air cavity packages for FETs and MMICs. All of our packages are plated with electrolytic nickel and gold and meet the demanding reliability requirements of the RF transistor industry. To meet the high power density requirements of state-of-the-art power transistors, our air cavity packages can have a flange made of CuW, Cu-CuMo-Cu, or other advanced materials. We offer dozens of open-tooled designs, plus we can work with you to design a custom, high performance package at the lowest possible cost.
Our packaging products are divided into four general categories:
- Ceramic air cavity packages
- CuPacksTM
- BeO Packages
- Plated Flanges
Our engineers will work with you to recommend the optimal package for your RF device.
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