CuPacks^TM

Cutting edge, high power Si and GaN transistors and MMICs demand very low thermal resistance and very low RF loss. CuPacks^TM deliver outstanding performance for both requirements. These unique packages feature 0.2 mm thick copper leads and base, and an alumina ceramic ringframe. CuPacks^TM are electrolytically plated with nickel + gold and are compatible with a wide range of die attach materials. CuPacks^TM are surface mount packages whose leads can be formed in straight, gull wing or J-shaped configurations.

Advantages of CuPacks^TM

1. Very low thermal resistance: die attach onto a 0.20 mm thick copper base.
2. Ni + Au plating compatible with AuSi or AuSn eutectic die attach.
3. Very low RF loss: air cavity with alumina ceramic ringframe.
4. Industry standard footprints, interchangeable with many plastic packages.
5. Direct bond copper construction; narrow lead pitch is possible.
6. Cavity area up to 3.8mm x 3.8mm for 420°C rating. Cavity up to 5.0mm x 5.0mm for 320°C rating.
7. Wide variety of standard designs, plus new designs can be rapidly fabricated per customer print.
8. More than 15 years of proven performance and reliability.

The Z-50 Program

If none of Zentrix’s CuPack^TM designs meet your exact requirements, do not worry! Zentrix can fabricate a custom CuPack^TM per your design per our Z-50 Program. Zentrix will produce 50 parts in 6 weeks for a fixed price of $2000.00.

CuPack^TM Design Rules

Copper thickness, backpad: 0.20 mm (0.008").
Copper thickness, leads: 0.20 mm (0.008").
Copper lead width: 0.38 mm (0.015") minimum.
Spacing between leads: 0.38 mm (0.015") minimum.
Alumina thickness: 0.50 mm (0.020") standard, other thicknesses available if design permits.
Cavity area: up to 3.8mm x 3.8mm (0.15" x 0.15") for 420°C rating.
Cavity area: up to 5.0mm x 5.0mm (0.20" x 0.20") for 320°C rating.