Direct Bond Copper substrates: available on beryllia or alumina.
High purity copper sheets 0.010" or 0.012" (250 or 300 microns) thick can be directly bonded to BeO or alumina substrates by the direct bond copper process. The two materials are bonded by a ternary phase of Be-Cu-O and Al-Cu-O respectively. The result is a strong, hermetic bond of thick copper that provides a low cost alternative for applications requiring low thermal resistance and high current-carrying capability. Plates of alumina or BeO are blanket bonded on both faces with copper, and then the copper is photoetched into the desired pattern. After patterning, the copper can be plated with Ni and gold.
Ceramic thickness: 0.025" or 0.040"
Ceramic plate sizes:
96% Alumina: up to 6.5" x 5.4"
99.5% Beryllia: up to 2.06" x 2.06"
Conductor lines and spaces: 0.020" min.
Tolerance: +/- .005"
Cu thickness: .010" or .012"
Electroless Ni plating thickness: 80 to 250 microinches
Electroless Au plating thickness: 2 to 120 microinches
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