Beryllia or alumina substrates metallized with thick film refractory metal, suitable for brazing and plating.
Zentrix can provide thick film metallized BeO and alumina (Al2O3) substrates. The refractory metal paste MoMn is screen printed onto the substrate, fired, and then plated with Ni and Au. This classic metallization provides the highest levels of adhesive strength between the thick film and ceramic substrate. The Ni plating provides a surface that is compatible with brazing (e.g., with CuAg eutectic braze) or subsequent plating. A gold plating atop the Ni provides a surface compatible with Au or Al wire bonding, and die attach with AuSi or AuSn.
Capabilities include:
- MoMn thick film metallization, 0.020" minimum gap width
- Electroless Ni: 80 – 300 microinches thick
- Elecroless Au: up to 150 microinches thick
- 99.5% BeO substrates up to 3" x 3"
- 29 – 96% alumina substrates up to 4" x 4"
- Laser cutting or dicing of the substrates
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