Press Releases

-- Press Releases - Archives

Newsletter Articles

-- Newsletter Articles - Archives

Trade Shows

History

Our Locations

Career Opportunities

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e-Business Tool - eWAM™

Lids

-- Combo-Lids®

-- Visi-Lids^TM

-- Micro-Lids^TM

-- Seam Seal-Lids^TM

-- Solder Reflow-Lids^TM

Bonding Wire & Ribbon

-- Bonding Wire Spool Info

-- Packaging Removal Instructions

Electrical Contact Alloys

Solder Alloys

-- Preforms, Ribbon, Wire

-- Shaped Wire/Turkshead

Thermal Management & Custom Clad

Ceramic Packages

-- Ceramic Air Cavity Packages

-- CuPacks^TM

-- BeO Packages

-- Plated Flanges

Ceramic Substrates

-- Direct Bond Copper (DBC)

-- Metallized Ceramic

-- Capabilities

Technical Papers

-- Technical Papers - Archives

Technology Reviews

-- GMR Technology Review

-- Solar Cells Technology Review

-- MRAM Technology Review

-- DVD Technology Review

-- Ophthalmic Technology Review

Online Tools

-- Lid Comparison

-- Solder Selector

-- WAMBRAZE^TM Selector

-- Substrate Properties Chart

-- RF Package Selector

PVD Products

-- Sputtering Materials

-- Sputtering Targets

-- Rotatable / Cylindrical Sputtering Targets

-- Target Bonding

-- Backing Plates

-- Evaporation Materials

-- Crucible Liners

Engineered Materials

-- Thermotech TE^TM

-- Silvertech PT^TM 1 Epoxy

-- PureCon^TM

-- UBM^TM

-- Silicon^TM

-- EvaPro^TM

-- SFG^TM

-- ME^TM

-- VCT^TM

-- Xtended Life^TM

-- HSC (High Shot Count)

-- CIGS

PVD Material List

-- Pure Metals

-- Precious Alloys

-- Alloys & Cermets

-- Borides

-- Carbides

-- Fluorides

-- Nitrides

-- Silicides

-- Oxides

-- Others

Thin Film Technology

-- History

-- Trade Shows

-- Career Opportunities

-- Directions

Hi Performance IR Optics & Assemblies

-- IR Coatings

  --- Broad Band Anti-reflective

  --- Long Wave Pass

  --- Band Pass Filters

-- Sensor Windows & Assemblies

  --- Visi-Lids™

-- Lenses & Shaped Optics

Thin Film Hybrid Circuits

Flexible Sensors & Interconnects

Custom Engineered Coatings

-- Transparent Conductive Oxides

Thin Film Thickness Standards

Markets

-- Defense & Aerospace

-- Image & Sensing RF & Microwave Communications

-- Medical Technology

-- OEM

-- RF & Microwave Communications

Manufacturing & Quality

Material Characterization Form

Material Management

Chamber Services

Sputtering Target Recycling

Production Material

Plating Solutions

Photo Silver

High Purity Ni Alloys

-- High Purity Nickel Strip

-- Wire

WAMBRAZE^TM Materials

-- Gold Preforms

-- Wire

-- Ribbon

-- Rings

-- Powder and Paste

SilSeal^TM Materials

Jewelry

-- Sheet and Strip

-- Casting Grain

-- Wire

Investment Bar

-- Silver Bars

-- Gold Bars

Needle Ag

Manufacturing

-- Thin Film Tolerances

-- Packaging Material Capabilities

-- Packaging Material Tolerances

-- Tool Capabilities

Quality

-- Corporate Quality Policy

-- Analytical Capabilities

-- Business Certifications

-- Environmental Health & Safety Policy

-- RoHS Policy

-- MSDS Sheets

-- Material Shelf Life Commitments

-- Packing and Packaging Standards

Supplier

-- Supplier Quality Manual

-- Self Assessment and Quarterly Scorecard

-- Supplier Request for Change Procedure

-- Supplier Lean Six Sigma

Raw Material Statement

EICC Compliance Letter

Semiconductor

-- UBM

-- Traditional

-- Compound

Wireless

-- Crystal Oscillators

-- Power Amplifiers

-- SAW Devices

-- Ohmic Contact Materials

Photonics

-- Laser Diodes

-- LED's

-- VCSEL's

-- WDM and DWDM

-- MEM's

Data Storage

-- Optical Media Storage

-- Magnetic Data Storage

Hybrid/Micro Electronics

Memory

Performance Films

Solar/Photovoltaic

-- Concentrator Photovoltaic (CPV)

Precious & High-Value Material Management

Parts Tracking & Inventory Management

Shield Cleaning & Chamber Services

Key Technologies

-- Chemical Treatment

-- Surface Treatment

-- Advanced Surface Coating

-- Final Cleaning & Parts Conditioning

-- Inspections & Tests

-- On-Site Support

-- Parts Replacement & Refurbishment

Carbon Fiber Carrier Cleaning

-- CFC Clean^TM Process